Project ARMS represented at the IEEE FLEPS 2025 in Singapore
From June 22 to 25, 2025, the Project ARMS representative Chirag Mevada from Tampere University had the opportunity to
participate in the IEEE International Conference on Flexible and Printable
Sensors and Systems (FLEPS 2025), held at the National University of
Singapore (NUS). This prestigious annual event brought together leading
minds from academia, industry, and government to explore the latest
advancements in flexible electronics and sensor technologies.
Chirag Mevada was proud to showcase our latest research during the conference. Our participation included a poster presentation, “Long-Term Performance of Activated Wood Carbon Printed Supercapacitors: A Sustainable Alternative to Conventional Activated Carbon”. In this work, the project demonstrated the long-term cycling performance of printed supercapacitors made from Latvian State Institute of Wood Chemistry’s alder wood carbon material, outperforming the commercial Kurraray YP-80F supercapacitors over 10,000 charge-discharge cycles.
IEEE FLEPS 2025 served as a dynamic platform for researchers, engineers, and innovators to present cutting-edge developments in the field of flexible and printable electronics. The conference attracted a diverse international audience, with participants representing institutions and companies from across Asia, Europe, North America, and Australia. The global nature of the event fostered rich discussions and cross-disciplinary collaboration.
The conference program featured a robust lineup of plenary talks, invited presentations, technical sessions, and industry panels. Topics covered included:
- Printed and stretchable sensors
- Flexible hybrid electronics
- Bio-integrated and wearable systems
- Energy harvesting and storage
- Emerging materials and fabrication techniques
- Standardization efforts in flexible electronics
Notable speakers included experts from the leading scientific institutions and industry. Their insights highlighted both the scientific progress and the real-world applications of flexible sensor technologies in areas such as healthcare, robotics, and the Internet of Things (IoT).
For project ARMS, the IEEE FLEPS 2025 provided valuable exposure to emerging trends and technologies that align closely with our project’s goals. The event also reaffirmed the importance of interdisciplinary collaboration and the growing impact of flexible electronics on modern technology. We are excited to integrate the insights gained from the conference into our ongoing work and to continue contributing to this rapidly evolving field.
Our work, presented at the conference,
has been published in its proceedings (DOI: 10.1109/FLEPS65444.2025.11105690).
For more information about the conference, please visit the IEEE FLEPS 2025 website.